Shenzhen Willdone Technology Co., Ltd.
Main products:Soldering Station,Electric Screw Driver,Soldering Tips,ESD Slipper,ESD Gloves,ESD Wrist Strip,Magnifying Lamp
Contact Us
  • Contact Person : Mr. cheng billy
  • Company Name : Shenzhen Willdone Technology Co., Ltd.
  • Tel : 0086-755-25835230
  • Fax : 0086-755-25835287
  • Address : -1,Hong kong,11/F FRONT BLK HANG LOK BLDG 130 WING LOK ST SHEUNG WAN HK
  • Country/Region : China

BGA Reworking System JOVY SYSTEM RE8500

BGA Reworking System JOVY SYSTEM RE8500
Product Detailed
BGA Rework Station Medium & large scale service centers Mobile electronics and communications systems devices Cellular, PDA

BGA Rework Station

Jovy RE-8500 Fields Of Application

• BGA rework Multiple profiling options (standard lead-free, standard leaded and user define). • Wide lower heating area (500mmx 450mm). • Five channels thermocouple real time temperature reading. • Process & profile analyzer for complete process study and control. • Accurate temperature readings of +/- 2°C. • Alarm set point to increase the process safety and control. • Equipped with many types of reflectors for focusing and spotting the upper heater heating area. • Password protection for data and settings lock.  • High ramp preheating and reflow up to 2.5°C/sec.  • Optimum heating with 3 controlled heating zones.  • Ideal application cooling phase in two methods optionally direct and indirect air flow, adjustable airflow power fan. • All Windows multi lingual OS. Specifications

Dimensions L x W x H

520mm x 600mm x 310mm

Working depth

220 mm

Power supply

230 V AC, 50/60 Hz,16 A

Installed heating power

Total 3600 Watt. Upper heater power is 600W & Lower heaters power are 3000W

Upper heater size

60mm x 120 mm one zone

Bottom heater size

340mm x 280mm ,2 separate heating zones

Distance of Upper heater to PCB

Standard is 60 mm , range from 30mm to 80mm

Distance of Lower heater to PCB

35 mm

Temperature sensor channels

5 x k-type thermocouple (potential free) 2 main and 3 optional

Maximum component size PL

120mm x 60 mm


via PC with Jovy control room USB 2.0

Operating Systems

Windows XP® or Windows Vista® Windows7®

Software Features• Interactive and Easy to use Interface. • Multi-languages interface. • Fast USB 2.0 connection. • Profiles: Profiles Creation: where the user can create standard profiles or free profiles then download it to RE-8500 memory or save it on PC. Profiles Editing: user can load any pre-saved profile on PC and edit its parameters. Profile manager mode: where the user will be able to import, edit, delete and save the profiles saved on RE-8500 memory could be re-download it to RE-8500. Retrieve any profile stored in RE-8500 memory to run it through the interface. • Processes: Run manual processes or pre-saved Profile process. Monitoring heat distribution on PCB by drawing thermo-couples reading on different five positions in a real time. Do analysis on run process thermo-couples reading in real time. Save unlimited number of run process graphs and data (thermo-couples reading) files. Complete process thermal behavior analysis tool. • Upgrade RE-8500 firmware through Software through USB 2.0 connection. • Full Control of all RE-8500 peripherals like fan, pump and laser. • Support Celsius and Fahrenheit temperature unit standards. Offline mode: Can create profiles and analyze run process data files without connecting RE-8500. Field of applicationsBusiness field• Laptop and mother boards rework and repair. • Game consoles applications rework and repair. • Small and medium size electronics assembly factories. • Military sophisticated applications rework and repair. • Medical equipment applications rework and repair. • Automotive applications rework and repair. • Light systems and LED applications. • Home appliance and personal Gadgets applications rework and repair. • Networking and communication applications rework, repair and assembly. • Power supply and control PCB applications rework, repair and assembly. Components type• BGA on Flex printed circuit. • PTH connectors, card slots and sockets. • Metal components housing. • Micro lead frame. • PBGA with heat sink. • Processor plastic sockets. • Metal Shielding. • CSP and fine pitches BGA. • Plastic PLCC. • Through hole sockets. • Heavy Mass CCGA & CBGA. • Underfill or epoxy coated components. • QFN, VQFN and advanced design QFN. • Package over package (POP).

BGA Reworking System JOVY SYSTEM RE8500

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